Thermal Management

CVD diamond’s thermal management properties address today’s single biggest cause of failure in electronics – heat :

  • Outperforms copper, silicon carbide and aluminum: by factors of 3-10

  • Heat spreaders with 4 levels of thermal conductivity available: 1000-2000 W/mk

  • GaN-on-diamond wafer substrates available: 3 x improvement in heat dissipation while preserving RF performance.

Our expertise ensures ease of customer implementation, KYAMMC helps customers integrate its free standing diamond heat spreaders into their modules and systems.

  • Range of thicknesses available: up to 3mm thick

  • Very flat and low roughness ensuring ease of attachment and minimized thermal interface resistances.

  • Free-standing diamond available in large areas up to 140mm in diameter that can be laser cut to any required size.

  • Metallization solutions enabling die bonding with low thermal barrier resistance, consistent with industry standard soldering and brazing.

Extended device lifetimes for a given power level and increased performance and efficiency, KYAMMC CVD diamond heat spreaders and GaN-on-diamond wafers enable the next generation of :

  • High Power RF Devices

  • Optoelectronics Devices

  • High-Voltage Power Devices

  • Semiconductor Assembly & Test Equipment.

TOP